DIPLAT at GrindTec 2016

GrindTec, one of the biggest and most important trade shows on grinding technologies, will take place from the 16th to the 19th of March 2016. DIPLAT partners EWAG and Reishauer will be showing their latest developments.

Don’t miss out the presentation of DIPLAT results and the demonstration of 3D Pulsed Laser Ablation (PLA) processing of drilling and milling tools on a LaserLine machine at the UGG booth in hall 7.

Find more about GrindTec 2016
Invitation to the demonstration of DIPLAT technology

Schweizer Schleif-Symposium 2016

The swiss grinding symposium (Schweizer Schleif-Symposium) took place on the 19th and 20th of January 2016. Research results from DIPLAT project on the laser touch dressing of diamond dressing wheels were presented. The symposium attracted over 230 participants from industries and universities mainly from Switzerland, Germany and Austria.

More information about the event (in German)
More information about the presented results

DIPLAT organizes the second Open Meeting with Element Six in Oxford

The open meeting on December 8, 2015 will explore following topics:

  • Industrial potential of pulsed laser machining of ultra hard materials
  • Laser machining of tools, from abrasive surfaces to dressing wheels, from drills to mills
  • Ordered micro abrasive structures: advances in materialographic probe preparation
  • Laser touch dressing of diamond dressing wheels
  • Ultra hard materials

The flyer with further information can be downloaded here.

The detailed program of the meeting can be found here.