GrindTec 2016 – a great success for DIPLAT

DIPLAT @ GrindTec

The DIPLAT project was presented at this year’s GrindTec fair, at the booth of the United Grinding Group. The presentation of the project results and the live demonstration of the production of milling tools were most certainly one of the highlights of the fair. The tools were produced, on a fully automated LaserLine Ultra (EWAG AG), using laser processes developed during DIPLAT.

Have a glimpse on how fluted tools are produced using the PLA technology developed during the DIPLAT project.