DIPLAT at GrindTec 2016

GrindTec, one of the biggest and most important trade shows on grinding technologies, will take place from the 16th to the 19th of March 2016. DIPLAT partners EWAG and Reishauer will be showing their latest developments.

Don’t miss out the presentation of DIPLAT results and the demonstration of 3D Pulsed Laser Ablation (PLA) processing of drilling and milling tools on a LaserLine machine at the UGG booth in hall 7.

Find more about GrindTec 2016
Invitation to the demonstration of DIPLAT technology